UNIVERSAL ADVANCED Semiconductor Fabrication Material Provenance Project Acronym: UASFMP

PROBLEM: Supply chains span borders and dozens of handlers, yet the semiconductor fabrication material provenance problem has no governed record: a product's origin, condition, and custody are asserted at each handoff and rarely verified, so counterfeits, spoilage, and diversion are discovered only after harm is done.

SOLUTION: IBM Cloud Ideas would provide a governed semiconductor fabrication material provenance record: every handoff, condition reading, and custody change logged with lineage, so provenance is provable end to end. It governs the record, not the shipment.

EVIDENCE BASIS: DOCUMENTED — the International Maritime Organization and U.S. Customs and Border Protection govern shipping and customs data; cold-chain failures and counterfeit goods are documented supply-chain risks; product recalls are tracked by the FDA and the Consumer Product Safety Commission. Source: IMO; CBP; FDA recalls.